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Laser Slicer (TH-LSS200)

Laser Slicer (TH-LSS200)
Laser Slicer (TH-LSS200)

Product Description

It is widely used for industries of solar wafer and semiconductor, specially in silicon wafer process industrial.
High quality laser beam, thin facula and small heating affection.
Cutting scope: 200x200mm, 300X300mm.
Cutting depth: 0.3mm.
Cutting width: 0.1mm.
Max cutting speed: 100mm/s.
Accuracy: +/-0.01mm.

More Product Features

HS Code: 84561000
Trademark: TIANHONG LASER
Model NO.: TH-LSS200
Standard: ISO9001-2000
Productivity: 500 sets/year
Origin: Suzhou
Packing: Plywood Case
Min. Order: 1 Set
Transportation: By Air or Sea
Company: Suzhou Tianhong Laser Equipment Co., Ltd.

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