Laser Wafer Sawing System & Laser Wafer (TH-LWS20)

Min. Order: 1 set
Production Capacity: 1000sets/Year
Transport Package: Plywood Case
Payment Terms: L/C, T/T
Laser Wafer Sawing System & Laser Wafer (TH-LWS20)

Basic Info

Product Description

  • Model NO.: TH-LWS20
  • Specification: ISO 9001: 2000
  • HS Code: 8456100090
  • Trademark: tianhonglaser
  • Origin: Suzhou, China

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